45 Plasma and Electrochemical Deposition Techniques

Sunday, November 13, 2016: 3:30 PM - 6:00 PM
Golden Gate 5 (Hilton San Francisco Union Square)
Description:
This session will examine recent advances in the fundamental study and application of plasma processes, gas phase and electrochemical deposition techniques, including physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), and molecular beam epitaxy (MBE), electrochemical deposition and related approaches. Both experimental and theoretical contributions to this session are encouraged.

Sponsor:
Electronics and Photonics

Chair:
Elijah Thimsen
Email: elijah.thimsen@wustl.edu

Co-Chair:
Selma Mededovic Thagard
Email: smededov@clarkson.edu


3:30 PM
(45a) Vaporization of Nanoparticles in Dusty Plasmas
Necip Uner and Elijah Thimsen

3:46 PM
(45b) Increasing Contact Area for Scaled up Processing of Solids Using Nonthermal Plasmas
Necip Uner and Elijah Thimsen

4:02 PM
(45c) Process Control for Atmospheric Pressure Plasma Systems
Brandon S. Curtis

4:18 PM
(45d) Topographically Selective Deposition of Dielectrics Using Ion Implantation
Dara Bobb-Semple, Fatemeh Hashemi, Yin Fan, Tobin Kaufman-Osborn and Stacey F. Bent

4:34 PM
Break

4:40 PM
(45e) Epitaxial Growth and Atomic Characterization of Fe-BTO(111) on SiC (0001) Using MgO Template Layer
Sue J. Celestin and Katherine S. Ziemer

4:56 PM
(45f) SiC Substrate Cleaning for Epitaxy Using a Thermally Generated Atomic Hydrogen Beam
Negar Hamedani Golshan and Katherine S. Ziemer

5:12 PM
(45g) Chiral Templating of Self-Assembling Nanostructures By Circularly Polarized Light
Jihyeon Yeom, Bongjun Yeom, Joong Hwan Bahng, Petr Král and Nicholas Kotov

5:28 PM
(45h) Anomalous ALD Growth per Cycle Under Precursor-Limited Conditions
Andrew Poissant, Hossein Salami and Raymond A. Adomaitis

5:44 PM
(45i) Development of a Robust Computational Methodology for Value-Added Understanding of Selective Conducting Thin Film Deposition
Andrew J. Adamczyk and Sergei V. Ivanov
See more of this Group/Topical: Materials Engineering and Sciences Division
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