171 Organic, Polymeric, and Hybrid Semiconductors

Monday, November 14, 2016: 12:30 PM - 3:00 PM
Continental 2 (Hilton San Francisco Union Square)
Description:
Organic, polymeric, and hybrid-inorganic (such as organic-nanoparticle and hybrid perovskite) semiconductor materials continue to receive interest due to their compatibility with low-cost, high throughput processing techniques. These materials have been demonstrated as the active material in light-emitting devices, photodetectors, thin-film transistors, lasers, and a variety of sensors. This session welcomes submissions examining the synthesis, processing and characterization of organic, and hybrid organic-inorganic semiconductor materials and their application in electronic and optoelectronic devices. Experimental, theoretical and computational papers are welcome.

Sponsor:
Electronics and Photonics

Chair:
Gaurav Giri
Email: gg3qd@virginia.edu

Co-chairs:
Joshua Choi
Email: jjc6z@virginia.edu

Bryan W. Boudouris
Email: boudouris@purdue.edu


12:30 PM
(171a) Solution-Processed, Lead-Free Metal Iodide Thin Films for Photovoltaic Applications
Umar H. Hamdeh, Rainie D. Nelson, Bradley J Ryan and Matthew G. Panthani

1:02 PM
(171b) In-Situ X-Ray Diffraction Studies on the Self-Assembly of Metal Halide Perovskite Thin Films
Alexander Chen, Benjamin Foley, Justin Girard, Jennifer Ma, Detlef-M. Smilgies and Joshua Choi

1:34 PM
Break

1:40 PM
(171d) Dopant Diffusion and Implications for Device Stability
Adam J. Moulé, Jun Li, Daniella Holm, Shravya Guda, Correy Koshnick, Souleymane Omar Diallo and Stephan Friedrich

2:12 PM
(171f) Solution Shearing of Conjugated Polymer with Highly Aligned Nanofibrillar Structures for Organic Field-Effect Transistors
Ping-Hsun Chu, Nabil Kleinhenz, Nils Persson, Michael McBride, Jeff Hernandez, Jung Ok Park, Mohan Srinivasarao and Elsa Reichmanis

2:28 PM
(171g) Automated Analysis of Orientational Order from Images of Fibrillar Thin Films
Nils Persson, Michael McBride, Martha A. Grover and Elsa Reichmanis
See more of this Group/Topical: Materials Engineering and Sciences Division