28 Plasma and Electrochemical Deposition Techniques

Sunday, November 8, 2015: 3:30 PM - 6:00 PM
251D (Salt Palace Convention Center)

Description:
This session will examine recent advances in the fundamental study and application of plasma processes, gas phase and electrochemical deposition techniques, including physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), and molecular beam epitaxy (MBE), electrochemical deposition and related approaches. Both experimental and theoretical contributions to this session are encouraged.

Sponsor:
Electronics and Photonics
Chair:
Selma Mededovic Email: smededov@clarkson.edu
Co-Chair:
Charles W. Monroe Email: cwmonroe@umich.edu
- indicates paper has an Extended Abstract file available on CD.



3:30 PM
(28a) Generalized Approach for Selecting Viable Plasma Chemistries in Patterning Magnetic Metals
Jack Kun-Chieh Chen, Taeseung Kim, Nicholas Altieri and Jane Chang


3:55 PM
(28b) Comparison of the Plasma Polymerization Domains for Deposition of Various Organosilicon Monomers Using Atmospheric Pressure Plasma
Mary A. Gilliam and Susan A. Farhat


4:20 PM
(28c) Molecular Dynamics Simulation of Ge Deposition and Islanding on Amorphous Silica Substrates
Claire Y. Chuang, Sang M Han, Luis A. Zepeda-Ruiz and Talid Sinno

File available
4:45 PM
(28d) Electrochemical Behavior of Pd-X/C (X=Sn, Ni, Fe) Electro-Catalysts for Ethanol Electro-Oxidation in Alkaline Media
Carolina Romero, Alvaro Gómez, Carlos A. Cardona and Daniela Parra


5:10 PM
(28e) Development and Characterization of Electroless Copper Deposition Processes for Next-Generation Semiconductor Interconnect Applications
Lu Yu and Rohan Akolkar


5:35 PM
(28f) Grating-Based Surface Plasmon Enhancement of Optical Transmission through Wave Vector Matching Across a Thin Metal Film Via High Refractive Index Thin Oxide Film Deposition
Michael B. Johnson and Andrew C. Hillier
See more of this Group/Topical: Materials Engineering and Sciences Division
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