RF Plasmas for Thin Film Etching, Deposition, and Surface Modification

                   rf Plasmas for Thin Film Etching, Deposition, and Surface Modification

Dennis W. Hess
School of Chemical & Biomolecular Engineering
Georgia Institute of Technology
Atlanta, GA  30332-0100

Plasmas (sometimes referred to as glow discharges) used in thin film processing are partially ionized gases composed of ions, electrons and a variety of neutral species.  This atmosphere is highly chemically reactive and so promotes gas phase and surface reaction rates at low temperatures.  In addition to electron impact collisions in the gas phase to generate reactive species, ion and electron bombardment of surfaces occurs during plasma exposure.  These plasma characteristics permit film etching, polymerization, deposition and surface modification at low (room) temperature.  Due to the extensive array of chemistries that are possible, numerous applications ranging from electronic, photonic, sensor and microfluidic device fabrication, surface sterilization, artifact restoration and adhesion promotion have been explored.  This talk will describe the exploitation of these unique plasma properties to control thin film and surface chemistry, physics and nanostructure for specific application areas.  Two applications will be discussed:  etching of copper that is used as an interconnect material for integrated circuit fabrication and modification of surfaces such as paper and metals to control fluid wetting and adhesion.