274676 Facilitating Seed Germination by a Novel Method Using Nanoparticle Electrospray

Tuesday, October 30, 2012
Hall B (Convention Center )
Gang Wu1, Li Huang2, Jennifer Head2, Da-Ren Chen3 and Yinjie J. Tang3, (1)Enery, Environmental and Chemical Engineering Department, Washington University in St. Louis, Saint Louis, MO, (2)Washington University in St. Louis, St. Louis, MO, (3)Department of Energy, Environmental and Chemical Engineering, Washington University, St Louis, MO

Attributed to the rapid development of nanotechnology, its applications in many fields such as materials engineering and biomedicine have been extensively studied during past years. However, less research concerning about nanoparticle applications in agriculture has been reported. Here, we first time demonstrated that plant seed germination can be promoted by a novel nanoparticle electrospray technique. Germination rate of some plant seeds (e.g., lettuce seed) could be significantly improved by TiO2 nanoparticle electrospray. TEM and SEM-EDX images of seed cross section indicated the presence of mono-dispersed nanoparticle inside seed after electrospray treatment. Therefore, mechanisms contributed to seed germination enhancement have been speculated as that electronically dispersed nanoparticles can penetrate through seed coat and create “nano-holes” on seed coats, resulting in improved germination conditions. To verify its practicability, the shelf life test was also performed and significant enhancement effect was still observed on sprayed seeds even one month after the treatment, implying a promising application of this method in agriculture.

Extended Abstract: File Not Uploaded
See more of this Session: Poster Session: Nanoscale Science and Engineering
See more of this Group/Topical: Nanoscale Science and Engineering Forum