New Self-Healing Coatings

Wednesday, October 19, 2011
Exhibit Hall B (Minneapolis Convention Center)
Hossein Birjandi Nejad, Biomedical and Chemical Engineering, Syracuse University, Syracuse, NY, Xiaofan Luo, Flow Polymers, LLC, Celeveland, OH and Patrick Mather, Biomedical and Chemical Engineering Department, Syracuse University, Syracuse, NY

Most self-healing materials to date show limited healability and high material/fabrication process costs. In our group, we have developed thermally triggered self-healing coating materials in which crack-closing occurs through a shape memory effect of a thermoset matrix and crack re-bonding occurs by diffusion of an interpenetrating thermoplastic component. In order to apply the coatings on metal substrates, two methods were used. In the first method, poly(e-caprolactone) (PCL) was electrospun onto the substrate, yielding a fiber web, and then an epoxy copolymer formulation (DGEBA/NGDE/Jeffamine D-230) was spin-coated onto the fiber web. Following epoxy cure, the interpenetrating composite coating exhibits the described self-healing characteristics. Our second method utilized polymerization-induced phase separation (PIPS) of epoxy and PCL, yielding a distinct morphology also amenable to self-healing. Phase separation kinetics and blend morphology was investigated using optical microscopy, turbidity measurement, and differential scanning calorimetry. For both approaches, structural self-healing (crack closure) was observed using microscopy, while functional recovery (corrosion resistance restoration) was investigated using linear sweep voltammetry on samples exposed to NaCl/ solution. Both approaches led to excellent structural and functional self-healing. From potentiostat results, corrosion current density and consequently, corrosion rate was calculated. Results indicate enhanced corrosion density for healed samples. Moreover, self-healing during immersion in water was proved to be effective, indicating applicability to naval and biomedical applications.

Acknowledgment: This project is sponsored by DOE through collaboration with NEI Corporation.


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See more of this Session: Mesd Poster Session
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