Nanowire Assembly and Interconnect Formation Using Nano-Solders

Nanowires are receiving increasing interest as essential components in future nanoelectronics. To date the synthesis and assembly techniques of nanowires have been well developed. In this research, we show our recent results in using nano-solders to assemble and join nanowires for nanoelectronics applications. Tin-based and indium-based lead-free nano-solders have been synthesized directly onto multisegmented metal nanowires or conducting polymer nanowires by template assisted electrodeposition method. After synthesis, nanowires are assembled in a so called “liquid solder reflow” process, in which the nano-solder nanowires are assembled in a liquid medium and solder joints are formed between nanowires. 2D or 3D ordered nanowire arrays are formed by either electric field assisted alignment (dielectrophoretic assembly) or magnetic field assisted alignment. Nano-solders, when combined with assembling techniques, are used to efficiently connect nanowires and nanowire electronic components with low contact resistance, which are very well suited for sensor as well as nanoelectronics applications.