The objective of our current study is to understand and predict the deposition conditions that result in dewetting. We performed several depositions on different substrates including silicon wafers, glass slides, and PMMA-coated surfaces. Solvent vapors with different solubility parameter and vapor pressure including t-butanol, water, and isopropanol were also used. Scanning electron microscopy (SEM) and white light interferomety were used to investigate dewetted structures following deposition. The feature size of the dewetted structures depends on the film thickness, the film growth rate, and the type of solvent. A kinetic model will be discussed that compares rates of film growth, polymerization, and phase separation to explain dewetting behavior.
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