High Aspect Ratio Uv-Nano-Embossing Using a Novel Low Cost Nano-Mold Fabrication Technique

Mary B. Chan-Park and L. Q. Chen. School of Chemical and Biomedical Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 360014, Singapore

UV embossing is a replication technique offering high efficiency, throughput and low cost requiring only mild process conditions such as room temperature and low pressure. It has been widely used to study and fabricate optoelectronic devices, electro-mechanical devices and biotech devices in the biomedical, pharmaceutical, and food industries etc. Small feature sizes, high aspect ratio and large pattern area are important research aims of the embossing technology. However, since nano- embossing is a technique involving pattern contacting transfer, a high resolution mold is essential. Because these nano-molds are usually fabricated using high resolution complicated processing techniques such as electron beam writing, cost of the molds can be prohibitive. High aspect ratio nano-channels are also difficult to achieve. In this article a simple and cheap method to make nano-scale pattern mold is described.

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