Friday, 4 November 2005: 12:30 PM-3:00 PM
207 (Cincinnati Convention Center)

Polymers (08a)

#608 - Polymer Thin Films and Interfaces IV: Functional Polymer Systems (08A22)
This session is a forum for the application of polymer thin films involving conducting organics, microelectronics, and sensors. Submissions are invited concerning new materials and molecules, characterization (e.g. morphology, orientation, intrinsic electronic properties), simulation and modeling, novel device applications and particularly research efforts which establish ties between the above issues.
CoChair:Dean M. DeLongchamp
Chair:Rachel A. Segalman
12:30 PMNew Emissive Materials for Efficient and Stable Blue Organic Light Emitting Diodes
Samson A. Jenekhe, Abhishek P. Kulkarni, Yan Zhu, Christopher J. Tonzola, Angela P. Gifford
12:46 PMUltrathin Films by Covalent Molecular Assembly: Polythiophene-Polyimide Composites with Reduced Surface Resistivity
Fengxiang Zhang, M. P. Srinivasan
1:02 PMEffect of Chemically Modified Dielectric Interfaces on Semiconducting Polymer Chain Orientation
Brandon M. Vogel, Dean M. DeLongchamp, Daniel Fischer, Sharadha Sambasivan, Eric K. Lin
1:18 PMMeasuring Structure and Order Development in Organic Semiconductor Films with Soft X-Ray Spectroscopy
Dean M. DeLongchamp, Eric K. Lin, Daniel Fischer, Sharadha Sambasivan, Brandon M. Vogel, J. M. J. Frechet, Vivek Subramanian, Amanda R. Murphy
1:34 PMReversible Switching of Conducting Polymer Films between Superhydrophobicity and Superhydrophilicity
Lianbin Xu, Wilfred Chen, Ashok Mulchandani, Yushan Yan
1:50 PMSegregation, Leaching, and Adsorption of Small Molecules in Polymer Thin Films: Implications for Immersion Lithography
Erin Jablonski, Wesley Reinhardt, Daniel Fischer
2:06 PMPlasma Treatment and Surface Analysis of Polyimide Films for an Electroless Copper Build-up Process
Sue Ann Bidstrup Allen, D. Bhusari, Harley Hayden, Paul A. Kohl
2:22 PMQuantification of the Reaction-Diffusion Front in Photoresist Thin Films
Bryan D. Vogt, Vivek M. Prabhu, Shuhui Kang, Eric K. Lin, Wen-li Wu, Sushil K. Satija, Karen Turnquest
Sponsor:Materials Engineering and Sciences Division

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