Friday, 4 November 2005: 8:00 AM-10:30 AM
301 (Cincinnati Convention Center)

Electronics and Photonics (08e)

#586 - Reaction Kinetics in Electronic Materials Processing (08E04)
Bulk gas phase and liquid phase reactions, reactions in plasmas, and reactions occurring at gas-solid, solid-liquid and solid-solid interfaces are essential to the fabrication of modern electronic devices. This session is focused on topics related to the evaluation and control of reaction kinetics during the processing of electronic materials, including experimental evaluations and modeling and simulation efforts.
CoChair:Katherine S. Ziemer
Chair:Bridget R. Rogers
8:00 AM586aControlling Ultrashallow Junction Formation through Surface Chemistry
Edmund G. Seebauer, Kapil Dev, Charlotte T. M. Kwok, Richard D. Braatz
8:20 AM586bDirected Self Assembly of Si and Ge Nanocrystals on Hfo2 through Kinetically Driven Patterning
Scott K. Stanley, Sachin V. Joshi, Sanjay K. Banerjee, John G. Ekerdt
8:40 AM586cGrain Focused Simulation of Zirconia Cvd
Max Bloomfield, Zhe Song, Bridget R. Rogers, Timothy S. Cale
9:00 AM586dAn Electrochemical Impedance Spectroscopy Study of Chloride and 3-Mercapto-1-Propanesulfonic Acid Interactions in Acidic Copper Electroplating Bath
Hung-Ming Chen, Satish J. Parulekar, Alan Zdunek
9:20 AM586eCharacterization of Copper Chemical Mechanical Polishing in Nitric Acid Slurries
Moganty Surya Sekhar, S Ramanathan
9:40 AM586fDecomposition Kinetics of Diethylzinc by Quantum Chemical Calculations
Young Seok Kim, Yong Sun Won, Helena Hagelin-Weaver, Tim Anderson
10:00 AM586gDecomposition of Aryl- and Alkylimido Precursors for the Cvd of Tungsten Nitride: a Combined Density Functional Theory and Experimental Study
Yong Sun Won, Young Seok Kim, Tim Anderson, Lisa McElwee-White
Sponsor:Materials Engineering and Sciences Division

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