| Wednesday, 2 November 2005: 12:30 PM-3:00 PM | |||
| 264 (Cincinnati Convention Center) | |||
Interfacial Phenomena (01c) | |||
| #357 - Imaging of Surfaces (01C11) | |||
| This session targets papers using traditional or novel imaging techniques to characterize structures and physical properties on the surface of a liquid or that of a solid. Of interest are papers targeting research in the following areas, but are not limited to these: 1- defect analysis, metrology, and functionality of nano-scale structures pertaining to lithography processes and micro-devices, 2- formation and functionality of biological surfaces at the liquid or solid surfaces 3- assembly of nano-particles, surfactant monolayers or bilayers, polymers, etc ... | |||
| Cochairs: | Bing-Hung Chen Raymond R. Dagastine | ||
| Chair: | Eric M. Furst | ||
| 12:30 PM | 357a | Probing the Chemistry and Structure of Interfaces Utilizing Synchrotron Based Surface Science Joseph L. Lenhart, Daniel Fischer | |
| 12:50 PM | 357b | Measurement of Lipid and Protein Adsorption to the Air-Water Interface Using Quantitative Brewster Angle Microscopy Jonathan G. Fernsler, Patrick C. Stenger, Joseph A. Zasadzinski | |
| 1:10 PM | 357c | Studying Surfactant Aggregates on Metals by Atomic Force Microscopy Hannes C. Schniepp, Ho C. Shum, Dudley A. Saville, Ilhan A. Aksay | |
| 1:30 PM | 357d | Image Analysis Methods for the Study of Biomolecular Complexes Using Afm Agnes Ostafin, Fei Liu | |
| 1:50 PM | 357e | Probing Effect of Rifampicin-Impregnated Silicone on Staphylococcus Epidermidis Biofilm Formation Xuemei Liang, Anfeng Wang, Ting Cao, Haiying Tang, Steven O. Salley, James P. McAllister II, K.Y. Simon Ng | |
| 2:10 PM | 357f | Probing the Adhesion Force between E.Coli and Modified Silicone Rubber Surfaces Ting Cao, Haiying Tang, Anfeng Wang, Xuemei Liang, Gregory W. Auner, Steven O. Salley, K. Y. Simon Ng | |
| 2:30 PM | 357g | Morphology and Amine Accessibility of (3-Aminopropyl)Triethoxysilane Films Prepared on Glass Surfaces Mark W. Vaughn, Wei Wang | |
| Sponsor: | Engineering Sciences and Fundamentals | ||
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