Tuesday, November 6, 2007: 12:30 PM-3:00 PM
Room 253 A (Salt Palace Convention Center)
Electronics and Photonics (08e)
#258 - Plasma Processing (08E01)
tba
Chair:	Vincent M. Donnelly
CoChair:	Sumit Agarwal
12:30 PM	258a		In Situ Measurement Of The Ion Incidence Angle Dependence Of The Ion-Enhanced Etching Yield In Plasma Reactors Rodolfo Jun Belen, Sergi Gomez, Mark Kiehlbauch, Eray S. Aydil
12:50 PM	258b		Prediction Of Feature Profile Evolution In Shallow Trench Isolation Etching John Hoang, Cheng-che Hsu, Jane P. Chang
1:10 PM	258c		The Effect Of Oxygen Addition In A Chlorine Plasma During Shallow Trench Isolation Etch Cheng-che Hsu, Jane P. Chang
1:30 PM	258d		The Effect Of Polymerizing Chemistry And Ion Flux On Oxide Fencing, Line Edge Roughness, And Micro-Trenching In Nano-Scale Interconnect Structures For 45 Node Reactive Ion Etching Process Ammar Alkhawaldeh
1:50 PM	258e		Reaction Mechanisms In Patterning Hafnium-Based Metal Oxide Thin Films Ryan M. Martin, Hans-Olof Blom, Jane P. Chang
2:10 PM	258f		Plasma Activation Of Polymer Surfaces For Enhanced Adhesion Eleazar Gonzalez II, Michael Barankin, Andrew G. Hsieh, Steve Babayan, Robert F. Hicks, Joseph Deitzel, John Gillespie Jr.
2:30 PM	258g		Investigation Of Physical Vapor Deposited Ta / W Multilayer Structure As A Copper Diffusion Barrier Prodyut Majumder, Christos G. Takoudis

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