Many industries that use technologies related with integrated circuits (IC) have begun to use more efficient processes. Their effort to achieve micro-scale processes has allowed them to have incorporated an abrasive process called Chemical Mechanical Planarization (CMP). Process which produces a waste composed of many organics (surfactants), abrasive particles (alumina and silicate) and most importantly copper. Copper is a heavy metal which is found in trace amounts in the human body, but whose unbound ions are extremely toxic. Copper concentrations in CMP and post-CMP cleaning effluents range from 1 to 25 mg/L and must be removed from the waste stream (Ogden et al, 2006). Bioremediation is the most recent investigative area that is being explored to treat Cu-CMP wastewaters. The use of bacteria Staphylococcus Soil Y5 to treat Cu-CMP effluents tries to solve the excess wastewater problem and explore the alternative of wastewater reuse in the IC-Industry. Our main objective was to use microorganisms to remove Cu (II) from filtered post-CMP wastewater. Typical results for copper removal ranged from values 29 to 54 percent. The result levels of our process could change considerably with much needed research and development.