Preliminary Program subject to change
01F04 Materials Synthesis and Processing with Supercritical Fluids II
OverviewThis session will focus on the use of supercritical fluids to achieve superior material properties or processing enhancements relative to conventional techniques. Papers are sought that provide fundamental understanding, process description, and characterization. Topics of interest include, but are by no means limited to the synthesis, processing and modification of novel particles, fibers, films, coatings and composite materials; the preparation and processing of nanomaterials; an well as advances in techniques including rapid expansion, antisolvents, self assembly and impregnation. Papers related to the application of supercritical fluids in the microelectronics and semiconductor industries are particularly encouraged.
Primary SponsorHigh Pressure (01f)

Chair

Raashina Humayun
Novellus Systems Inc
4000 N 1st St
San Jose, CA 95134

Phone Number: 408 545 3793
Email: raashina.humayun@novellus.com

CoChair

Rajesh Dave
New Jersey Institute of Technology
Mechanical Engineering Department, YCEES 208
138 Warren Street
Newark, NJ 07102

Phone Number: 973 596 5860
Fax Number: 973 642 7088
Email: dave@NJIT.EDU
Development of Supported Nanoparticulate Metal Complexes Using Compressed Carbon Dioxide as Antisolvent
Chad A. Johnson1, Sarika Sharma2, Bala Subramaniam1 and A.S Borovik2, (1)Chemical Engineering, University of Kansas, 1530 W 15th Street, 4120 Learned Hall, Lawrence, KS 66045, (2)Chemistry, University of Kansas, Lawrence, KS 66045
Reductive Deposition of Cerium Oxide Films in Carbon Dioxide
Adam O'Neil, Chemical Engineering, University of Massachusetts, Goessmann Laboratory, 686 N Pleasant Street, Amherst, MA 01003 and James J. Watkins, Chemical Enginnering, University of Massachusetts, Goessmann Laboratory, 686 N Pleasant Street, Amherst, MA 01003
Synthesis of Metal Oxide Nanoaerogels Via a Sol-Gel Route in Supercritical CO2
Ruohong Sui, Amin S. Rizkalla and Paul A. Charpentier, Chemical & Biochemical Engineering, University of Western Ontario, Western Road, London, ON N6A5B9, Canada
Copper Chelation for Microelectronic Interconnects in Supercritical Carbon Dioxide
Randy Weinstein1, Carol Bessel2, Dorothy Skaf3, Donna Omiatek4 and Laurel Grotzinger3, (1)Villanova University, Department of Chemical Engineering, 800 Lancaster Ave., Villanova, PA 19085, (2)Chemisty, Villanova University, Department of Chemical Engineering, 800 Lancaster Ave., Villanova, PA 19085, (3)Chemical Engineering, Villanova University, Department of Chemical Engineering, 800 Lancaster Ave., Villanova, PA 19085, (4)Chemistry, Villanova University, Department of Chemical Engineering, 800 Lancaster Ave., Villanova, PA 19085
Copper Etching Using Hexafluoroacetylacetone (Hfach) Dissolved in Supercritical Co2: a Kinetic Investigation
Michael L. Durando and Anthony J. Muscat, Chemical and Environmental Engineering, University of Arizona, P.O. Box 210011, Tucson, AZ 85721
Comparative Study of Covalent Molecular Assembly of Oligoimide Ultrathin Films in Supercritical Carbon Dioxide and Liquid Solvent
Sreenivasa Reddy Puniredd, Department of Chemical and Biomolecular Engineering, National University of Singapore, 4 Engineering Drive 4, Singapore 117576, Singapore and M. P. Srinivasan, Chemical and Biomolecular Engineering, National University of Singapore, 4 Engineering Drive 4, Singapore 117576, Singapore

Engineering Sciences and Fundamentals